Foundry annual 12-inch-equivalent wafer capacity converts a mixed fab footprint to a common 12-inch wafer basis so aggregate manufacturing scale can be compared more consistently.
TSMC said annual capacity exceeded 17 million 12-inch-equivalent wafers in 2025.
Capacity and shipments are different denominators
TSMC also reported 15.022 million 12-inch-equivalent wafer shipments for 2025. Dividing shipments by the reported capacity figure gives a rough ratio near 88%, but that is not a capacity-utilization rate.
Annual capacity is an installed-capability measure that can change as fabs ramp during the year. Shipments are realized output. Foundry Capacity Utilization therefore remains a separate analytical concept.
The incremental capacity came from leading edge
TSMC said the 2025 increase was primarily from expansion of 3nm advanced technologies. The capacity change should therefore be read with Process Node Revenue Mix, not as if every added wafer had the same economics.
Capacity only earns returns when demand fills it
More installed capacity can support future shipments, but it also raises the capital base that must be utilized. Compare capacity with Wafer Shipments, pricing, yield, and capital spending before concluding that a larger footprint is automatically more profitable.
Primary source: TSMC 2025 Form 20-F.
Part of the Semiconductor Foundry Economics
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- TSMOpen operating-model research →19 of 19 reviewed concepts in Semiconductor Foundry EconomicsCapacity, utilization, output, pricing, and yield6 of 6 bridge concepts supportedContinue through this bridge:Foundry Capacity UtilizationSemiconductor Manufacturing YieldWafer Average Selling PriceWafer Manufacturing CapacityWafer Shipments
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Compare foundries on installed wafer capacity alongside shipments and utilization rather than treating capacity as output.
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